量子电子学报 ›› 2020, Vol. 37 ›› Issue (6): 752-758.

• 半导体光电 • 上一篇    

基于OTP 修调功能的芯片量产方法研究

朱少华,梁鉴如   

  1. 上海工程技术大学电子电气工程学院, 上海201620
  • 收稿日期:2020-04-13 修回日期:2020-06-23 出版日期:2020-11-28 发布日期:2020-11-28
  • 通讯作者: E-mail: Jianru−t@126.com E-mail:1203119672@qq.com
  • 作者简介:朱少华( 1991 - ), 安徽亳州人, 研究生, 主要从事芯片自动化测试等方面的研究。E-mail: shaohua.zhu@novosns.com
  • 基金资助:
    Supported by Degree Construction Project of Detection Technology and Automation Devices of Shanghai University of Engineering Science (上海工程技术大学检测技术与自动化装置学科学位点建设项目, 19XXK003), High and New Technology Project of Shanghai Science and Technology Innovation Action Plan (上海市“科技创新行动计划”高新技术领域项目, 18511101600), Nature Science Foundation of Shanghai (上海自然科学基金, 19ZR1421700)

Research on chip mass production method based on OTP modification function

ZHU Shaohua, LIANG Jianru   

  1. School of Electrical and Electronic Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
  • Received:2020-04-13 Revised:2020-06-23 Published:2020-11-28 Online:2020-11-28
  • Contact: Shao-Hua Zhu E-mail:1203119672@qq.com

摘要: 在实际生产中, 受制造工艺的影响, 芯片内部的基准电压模块会有一定的偏差。在芯片量产测试时, 需 通过一种内嵌存储单元修调电路, 写入trim code 来控制芯片内部电路, 从而对芯片的参数进行微调。在测试过程 中存在一些因素导致测试失效, 需要进行复测提高良率。如果使用传统的方式进行一次性可编程(OTP) 烧写, 由 于量产测试时重复烧写, 会造成修调位错误烧写, 导致芯片失效。基于自动化测试设备(ATE) 设计了一种改进的 OTP 修调算法, 测量初始电压、频率, 并经过测试修正得出最合适的trim code, 在复测时避免了对芯片重复烧写 OTP。所提出方法提高了芯片测试良率, 降低了生产成本。通过对两片晶圆上8000 颗die 的测试结果进行分析, 验证了所提算法的可行性。

关键词: 光电子学, 半导体测试, 测试良率提升, OTP 修调算法, ATE 自动化测试平台

Abstract: In actual production, being affected by the manufacturing process, the reference voltage module inside the chip will have a certain deviation. During the chip mass production test, a kind of embedded memory unit trimming circuit is used to write trim code to control the chip’s internal circuits and fine-tune the parameters of the chip. As there are some factors that cause the test to fail during the test, retests are needed to improve the yield. However, if the traditional programming method is used for one time programmable (OTP) programming, the trim and program will be incorrectly programmed due to repeated programming during mass production testing, which will result in chip failure. Therefore, an improved OTP tuning algorithm is designed based on the automatic test equipment (ATE), which measures the initial voltage and frequency, and then tests and corrects the most appropriate trim code to avoid the repeated burning of OTP on the chip during retest. The proposed algorithm can improve the chip and reduce the production costs as well. The feasibility of the algorithm is verified by analyzing the test results of 8000 die on two wafers.

Key words: optoelectronics, semiconductor testing, improved test yields, OTP tuning algorithm, ATE automated test platform

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